Semiconductor Workflows: From Fabrication to Characterization

Semiconductor Workflows: From Fabrication to Characterization

Time: 11:00 a.m. PST | 2:00 p.m. EST

Semiconductor development relies on both advanced processing technologies and the ability to characterize materials and devices at every stage of the workflow. Understanding how fabrication processes influence structure, composition, and performance is essential for accelerating process optimization, improving yield, and enabling next-generation semiconductor technologies.

In this webinar, we will explore how Oxford Instruments supports semiconductor development from plasma-based processing through advanced materials characterization. We will begin with an overview of Oxford Instruments Plasma Technology solutions for etch and deposition, highlighting their role in front-end semiconductor processing and materials engineering. We will then introduce a range of complementary characterization techniques, including energy dispersive X-ray spectroscopy (EDS), atomic force microscopy (AFM), Raman spectroscopy, and nanoindentation, demonstrating how they can be used to investigate composition, morphology, mechanical properties, and material quality across numerous semiconductor applications.

The webinar will conclude with a published case study demonstrating how multiple analytical techniques can be combined to provide a more complete understanding of a 2D semiconductor material. By correlating information from different techniques, we will show how integrated processing and characterization workflows can provide deeper insight into material behavior, support process development, and help address complex semiconductor challenges.