SPIE Advanced Lithography 2022
For over 40 years, SPIE Advanced Lithography has played a key role in bringing together the micro- and nanolithography community. Lithography continues to be challenged to extend into ever-shrinking generations, yet remain manufacturable and cost-effective.
Talks
Wednesday 26 February 2020
- SESSION 5: Low damage etching by Inductively Coupled Plasma (ICP) and Atomic Layer Etching (ALE) of III-V materials to enable next generation device performance. Author(s): ): Mark Dineen, Matthew Loveday, Andy Goodyear, Mike Cooke, Andrew Newton, Stephanie Baclet, Tania Hemakumara Oxford Instruments Plasma Technology Ltd (UK).
- SESSION 6: Atomic Layer Etching of III-V materials to enable next generation device performance (Invited Paper), Craig Ward, Oxford Instruments Plasma Technology Ltd ( USA).
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For further information: SPIE Advanced Lithography