Meet Oxford Instruments at ISTFA 2025
November 18 - November 19, 2025
Join us at the 51st International Symposium for Testing and Failure Analysis (ISTFA) at Booth #420— the premier event for the microelectronics failure analysis community — where we’ll be showcasing our cutting-edge Electron Microscopy,Confocal Raman Microscopy, and Atomic Force Microscopy (AFM) technologies.
Featured Technologies:
- Electron Microscopy: High-resolution imaging for structural and compositional analysis of microelectronic devices. Discover our EDS and BEX solutions for rapid, high-resolution mapping of samples and contamination identification.
- Confocal Raman Microscopy: Non-destructive chemical characterization for materials and failure analysis. Learnmore about our latest product, the witec360 with hexalight spectrometer providing ideal for providing insights onnon-destructive profiling, stress field mapping, defect characterization and band gap analysis.
- Atomic Force Microscopy (AFM): Surface topography and mechanical property mapping at the atomic level using the Jupiter Discovery, a next-generation AFM designed to deliver the highest performance of any large sample AFM and optimized workflow.