We're looking forward to meeting you at the event and discussing your current work and workflows with you. If you would like to book a meeting with us at the show, please complete the form below.
Oxford Instruments provide industry-leading processes and tools for Failure Analysis (FA) dry etching de-processing, including:
Our Failure Analysis tools allow a wide range of processes, able to process small die or packaged devices through to 300mm wafers.
Booth Number: #320
28th Oct - 1st Nov
Plasma Technology, NanoAnalysis