International Symposium for Testing and Failure Analysis
ISTFA 2018

ISTFA 2018

Meet Oxford Instruments at ISTFA 2018

We're looking forward to meeting you at the event and discussing your current work and workflows with you. If you would like to book a meeting with us at the show, please complete the form below.

Oxford Instruments provide industry-leading processes and tools for Failure Analysis (FA) dry etching de-processing, including:

  • Polyimide removal (RIE or ICP mode)
  • Isotropic Nitride (passivation) removal (PE or ICP mode)
  • Anisotropic Oxide (IMD/ILD) removal (RIE or ICP mode)
  • Anisotropic Low-K Oxide removal (RIE or ICP mode)
  • Metal skeleton removal (RIE or ICP mode)

Our Failure Analysis tools allow a wide range of processes, able to process small die or packaged devices through to 300mm wafers.


Phoenix, Arizona

Booth Number: #320


28th Oct - 1st Nov


Plasma Technology, NanoAnalysis

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