21 June 2017
Pushing the bounds of nanoscale processing at ‘Nanotech 2017: Pushing the limits’ workshop
Oxford Instruments and the Kavli Nanoscience Institute at the California Institute of Technology (CALTECH) are holding a one day workshop on 19th July 2017.
This workshop will explore recent progress in nanoscale plasma processing research and development, plus looking at future trends in the fabrication and application of micro, nano and atomic scale structures and devices. It is free of charge and is open to anyone working in industry or academia, interested in the following areas.
“We are delighted to have attracted guest speakers of such high calibre and with such diverse experience in nanoscale processing to this event which we are sharing with CALTECH”, comments Frazer Anderson, Strategic Marketing and Business Development Director at Oxford Instruments Plasma Technology, “At Plasma Technology we thrive on sharing experiences with our peers and these events are an ideal opportunity to do just this.”
The agenda for the day will include:
- Silicon Vacuum Tubes, Max Jones, Scherer Group, Caltech
- DRIE Etch – Black Silicon, Karl Yee, Jet Propulsion Laboratory
- Atomic Layer Etch (ALE): A precision technique to enable tomorrow's technology, Mike Cooke, Oxford Instruments
- SiC Etch, Andrei Faraon, Caltech
- Atomic Layer Deposition (ALD) New developments for atomic scale processing, Thomas Miller, Oxford Instruments
- Growth of 2D Materials and Heterostructures, Robert Gunn, Oxford Instruments
- InP Etch, Ryan Briggs, Jet Propulsion Laboratory
- MEMs Processes, Vladimir Aksyuk, NIST/CNST
- Recent advances in PECVD technology, Hannah Morgan-Cooper, Oxford Instruments