TSV Plasma Polish Optimization and AFM characterization for Quantum Computing

Check out our on-demand webinar showcasing how the Oxford Instruments Jupiter AFM was used to characterize sidewall roughness in through-silicon vias (TSVs)—a critical factor in the performance of 3D qubit architectures for quantum computing.

Join Dr. Zhong Ren (Oxford Instruments Plasma Technology) and Dr. Marta Kocun (Oxford Instruments AFM) as they walk through the full process:

• TSV etching
• Plasma polishing
• AFM sidewall roughness characterization