Products
DEPOSITION TOOLSPlasma Enhanced Chemical Vapour Deposition (PECVD)Inductively Coupled Plasma Chemical Vapour Deposition (ICPCVD)Atomic Layer Deposition (ALD)Ion Beam Deposition (IBD)ETCH TOOLSInductively Coupled Plasma Etching (ICP RIE)Reactive Ion Etching (RIE)Deep Silicon Etching (DSiE)Atomic Layer Etching (ALE)Ion Beam Etching (IBE)
Learning
Figure 1. Comparison of indentation maps of hardness and reduced modulus performed in displacement and load control on Al—Cu eutectic sample plotted on matching scales. Load control map taken from subset of literature data [1] for matching scales for visual comparison.
Figure 2. Comparison of indentation mapping results measured using load control [1] and displacement control on an Al-Cu eutectic sample plotted as 2D histograms of achieved loads vs. contact depths and hardness vs. reduced modulus.