Join us at SEMICON China 2026

Join Oxford Instruments to enhance your semiconductor fabrication and characterisation capabilities with Oxford Instruments’ comprehensive range of solutions.

Achieve accurate and uniform etching, deposition, and growth of micro and nano-structures and films through atomic layer etching, atomic layer deposition, ICP (etching and deposition), PECVD, and Plasma Polish Dry Etch technologies for SiC applications with our plasma solutions. Measure crystal homogeneity, material stress, and strain in three dimensions through Raman imaging microscopy; investigate defects, surface roughness, elasticity, and electronic properties utilising Atomic Force Microscopy (AFM); analyse structure and elemental makeup with advanced electron microscopy methods including EDS, EBSD, and the innovative BEX (Backscattered Electron and X-Ray).

Visit our booth 2289 (Hall N2) at the Shanghai New International Expo Centre to discuss with our team how to meet the increasing semiconductor industry needs with our process solutions.

For further information, visit the SEMICON China 2026 website.