Digital Quantum Computing

Dr. Matt Hutchings, SeeQC

June 8: 1-2pm BST | 2-3pm CEST | 8-9am US EDT

SeeQC is developing the first digital quantum computing platform for global businesses. SeeQC combines classical and quantum technologies to address the efficiency, stability and cost issues endemic to quantum computing systems. The company applies classical and quantum technology through digital readout and control technology and through a unique chip-scale architecture. SeeQC’s quantum system provides the energy- and cost-efficiency, speed and digital control required to make quantum computing useful and bring the first commercially-scalable, problem-specific quantum computing applications to market.

The company is one of the first companies to have built a superconductor multi-layer commercial chip foundry and through this experience has the infrastructure in place for design, testing and manufacturing of quantum-ready superconductors. SeeQC is a spin-out of Hypres, the world’s leading developer of superconductor electronics. SeeQC’s team of executives and scientists have deep expertise and experience in commercial superconductive computing solutions and quantum computing. Seeqc is based in Elmsford, NY with design and test facilities in the UK and EU

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Quantum Imaging with Entangled Photons and EMCCD Cameras

Dr. Hugo Defienne, University of Glasgow

June 8: 2-3pm BST | 3-4pm CEST | 9-10am US EDT

Quantum imaging harnesses quantum properties of light and their interaction with the environment to go beyond the limits of classical imaging or to implement unique imaging modalities. In conventional quantum imaging systems, a non-classical state of light illuminates an object from which an image is formed on a set of photodetectors. In this respect, sources of entangled photon pairs are very prolific. Over the last decades, they have been used to achieve super-resolution [1] and sub-shot-noise imaging [2], as well as to develop new imaging approaches such as ghost imaging [3], quantum illumination [4] and quantum holography [5].

However, most of these experimental schemes require to measure intensity correlations between many spatial positions in parallel, a task that is much more delicate than forming an image by photon accumulation. Originally, this was performed using raster-scanning single-pixel single-photon detectors, but this process is very photon inefficient and time-consuming. In recent years, these systems were substituted by single-photon sensitive cameras, such as electron multiplied charge coupled devices (EMCCDs), to achieve faster quantum imaging with photon pairs and move this field closer to practical applications [6,7].

In this presentation, I will review photon-pair-based quantum imaging experiments that were developed and implemented with EMCCD cameras, including those manufactured by Andor. In particular, I will clarify what is the type of image information that is measured and exploited in these systems, and describe what are the drawbacks and advantages of EMCCD technology to achieve such a task. Finally, I will discuss the potential of other single-photon camera technologies for photon-pair-based quantum imaging, including single-photon avalanche diode cameras (SPAD) and EMCCD cameras from other companies (Nuvu), and compare them to the results obtained with the Andor model

Surface Engineering for High Performance Quantum Devices

Dr. Russ Renzas, Oxford Instruments Plasma Technology

June 8: 3:15-4pm BST | 4:15-5pm CEST | 10:15-11am US EDT

Next-generation quantum computers and quantum sensors require better materials and processes to reduce losses associated with substrate-metal, metal-vacuum, and substrate-vacuum interfaces in superconducting systems, as well as to reduce losses due to roughness in diamond and photonic systems. Low-loss superconducting nitrides deposited by PE-ALD offer improved performance for resonators and qubits, while high quality RIE and ALE etches achieve low roughness and reduce losses at substrate-vacuum interfaces. We will also discuss the importance of these techniques for low roughness diamond and photonic etches, superconducting 3D integration, and single photon detectors.

Superconducting Quantum Circuits for Quantum Technologies

Prof. Martin Weides, University of Glasgow

June 8: 4-5pm BST | 5-6PM CEST | 11-12pm US EDT

Quantum technologies based on on-classically interacting qubit states allow experimental realizations ranging from fundamental tests to quantum simulation & computing achieving a quantum advantage. Today, realising the second quantum revolution appears feasible, with superconducting quantum circuits having matured over the past years to one of the leading platforms with an unprecedented variety of implementation and application schemes. For instance, analogue quantum simulators can now tackle problems that are hard to solve. No sophisticated error-correction schemes are needed, making them very useful in particular for the study of universal effects such as hard-to-model open quantum systems. Their implementation with superconducting circuits seems ideal, due to their tailored functionality and broad toolbox, including qubits, bosonic modes, a range of coupling elements and additional drive tones.

In this talk, an introduction to the field will be given, including a view on technological challenges such as quantum circuit materials and processing, and exemplary quantum simulation applications such as the dynamics in ultra-strongly coupled systems or multi-state Landau Zener transitions.

Diamond Nanofabrication for Quantum Photonics and Nanomechanics

Dr. Paul Barclay, University of Calgary

June 8: 5-6pm BST | 6-7pm CEST | 12-1pm US EDT

Diamond has emerged as a key material for quantum photonic devices that have applications in quantum sensing, communications, and computing. Its ability to host high quality spin qubits, combined with its exceptional optical and mechanical properties make it an ideal platform for creating quantum photonic and nanomechanical devices. However, realizing suspended devices from high quality bulk diamond material is challenging. Over the past five years we have developed “quasi-isotropic” etching process for creating suspended/undercut devices from single crystal diamond. This has allowed us to develop a platform for realizing diamond optomechanical devices: mechanical resonators at GHz frequencies that can be controlled with light and can be coupled to diamond qubits. In this presentation I will discuss our fabrication successes and challenges, and highlight recent progress in creating state-of-the-art diamond devices.

AFM Solutions in Semiconductor Device Fabrication and Development

Dr. Ted Limpoco, Oxford Instruments Asylum Research

June 9: 1-2pm BST | 2-3pm CEST | 8-9am US EDT

Continuous downscaling of semiconductor technology nodes imposes ever more stringent requirements on metrology and failure analysis tools. In this talk, we will cover how atomic force microscopes (AFMs) can be used in process control, defects identification, and in the research and development of new materials. We will demonstrate how AFMs’ unmatched sub-nanometer resolution and wide variety of electrical measurement modes make it an essential characterization tool in present and future devices.

All you ever wanted to know about plasma etch processing for InP devices

Dr. Mark Dineen, Oxford Instruments Plasma Technology

June 9: 2-3pm BST | 2-3pm CEST | 8-9am US EDT

Indium phosphide (InP), the direct bandgap semiconductor, has multiple uses in optical and electrical devices. For a good quality final product, the InP dry etch step must repeatedly give the desired etched structures.

For many devices, the low surface damage and the surface quality of the sidewalls and base are particularly important.

In this presentation, you will learn about InP etching processes and the process conditions which will affect the final etch product focusing on sidewall and surface quality, with device examples.

From SEM to TEM, Qualitive and Quantitative Compositional Analysis of Semiconductor Devices

Dr. Sam Marks, Oxford Instruments NanoAnalysis

June 9: 3:15-4pm BST | 4:15-5pm CEST | 10:15-11am US EDT

In this presentation we will explore how energy dispersive spectroscopy (EDS) can be utilized to solve some of the common problems that arise when analyzing semiconductor devices. Looking at SEM, FIB-SEM and TEM, we will discuss best practice and how to optimize EDS results across the different electron microscope platforms.

Significant emphasis will be on improving the spatial resolution of EDS maps in the SEM, where we will discuss the benefits of performing low accelerating voltage SEM to make nanoscale SEM EDS analysis routine. Additionally, we will explore the benefits of STEM-SEM as an alternative to TEM, performing sub 10 nm EDS at 30kV to reduce the TEM workload.

Flexible, high performance plasma etch solutions for MEMs device manufacture

Dr. Mark Dineen, Oxford Instruments Plasma Technology

June 9: 4-5pm BST | 5-6pm CEST | 11am - 12pm US EDT

MEMS devices are having an increasing impact on our everyday lives with a wide variety of end applications from accelerometers to bio sensors. In this presentation you will learn about two different etch solutions used to etch deep Si features: Bosch and Cryo plasma etching. The benefits of each solution will be discussed.

Correlative Microscopy Applied on Solar-Energy Materials and Devices

Dr. Daniel Abou-Ras, Helmholtz-Zentrum Berlin

June 10: 1-2pm BST | 2-3pm CEST | 8-9am US EDT

This presentation will provide insight into the application of energy-dispersive X-ray spectroscopy (EDS) and electron backscatter diffraction on materials and devices for solar-energy conversion. It will be shown how EDS at low beam energies and currents can be applied to beam-sensitive materials and how using the LayerProbe feature, thicknesses as well as compositions of individual layers in thin-film stacks can be determined in a nondestructive manner. A particular focus will be set on the combination of various techniques on identical specimen areas for a correlative microscopy approach, involving techniques in scanning electron and scanning probe microscopy, as well as Raman microspectroscopy.

Structural Elucidation of Anionic O-Redox Cathodes for Li-ion Batteries

Dr. Gregory Rees, University of Oxford

June 10: 2-3pm BST | 3-4pm CEST | 9-10am US EDT

Li-rich cathode materials are potential candidates for next-generation Li-ion batteries. They have increased energy density due to storing charge at high voltages through the oxidation of oxide ions in the cathode material. However, oxidation of O²⁻ triggers irreversible structural rearrangements in the bulk and an associated loss of the high voltage plateau, which is replaced by a lower discharge voltage, and a loss of O₂ accompanied by densification at the surface.

Here we show that for Li-rich NMC (Li_1.2Ni_0.13Co_0.13Mn_0.54O₂), molecular O₂ trapped in the bulk is responsible for the voltage hysteresis. ¹⁷O magic angle spinning (MAS) nuclear magnetic resonance (NMR) and resonant inelastic X-ray scattering (RIXS) suggest that molecular O₂, rather than O₂²⁻, forms within the particles on the oxidation of O²⁻ at 4.6 V versus Li⁺/Li on charge. These O₂ molecules are reduced back to O²⁻ on discharge, but at the lower voltage of 3.75 V. We will quantify the amount of bulk O₂ using NMR relaxometry and compare this to the theoretical O-redox charge capacity, minus the amount of O₂ loss from the surface. The implication is that O₂, trapped in the bulk and lost from the surface, can explain O-redox.

Finally, we will discuss the role of benchtop NMR spectroscopy in monitoring electrolyte degradation for Li-rich cathodes. New ¹H and ¹⁹F species are observed over cycling along with appreciable changes in the observed relaxometry,and fluctuations in the measured diffusion coefficients, these are attributed to electrolyte degradation.

Applying Benchtop NMR to the Development and Quality Control of Battery Materials

Dr. James Sagar, Oxford Instruments Magnetic Resonance

June 10: 3:15-4pm BST | 4:15-5pm CEST | 10:15-11am US EDT

Improving the performance and reliability of next generation batteries relies on optimizing the current carrying electrolyte solutions inside them. Using benchtop NMR spectroscopy can lead to significant insights into batteries, from raw materials checking, right through the R&D cycle, to quality control in manufacturing. Benchtop NMR allows us to quantify key components in new formulations including salts and additives, quickly detect contaminants in electrolyte production, understand electrolyte breakdown process that cause battery failure and measure key performance criteria such as conductivity, diffusion and transference. These key applications will be discussed in the context of a number of recent case studies.

Atomic Layer Etch & Deposition: advanced plasma processing solutions to enable next generation GaN Power device performance

Dr. Mark Dineen, Oxford Instruments Plasma Technology

June 10: 4-5pm BST | 5-6pm CEST | 11am-12pm US EDT

New GaN power electronics are being developed for power conversion and delivery. In electric transportation such as electric and hybrid electric vehicles (EV and HEV), these devices are becoming increasingly important and device cost and efficiencies are critical for their success.

In this presentation, Dr. Mark Dineen talks about the best ALE and ALD solutions for GaN HEMT devices. We'll demonstrate how to achieve the ultra accurate etch depth control and high film quality needed to provide the best GaN device performance.

Safer Batteries with AZtecBattery

Alexandra Stavropoulou, Oxford Instruments NanoAnalysis

June 10: 5-6pm BST | 6-7pm CEST | 12-1pm US EDT

Batteries are used in a wide range of portables devices (consumer electronics, portable devices such as power tools, etc.), taken for granted in our daily life. Li-ion batteries have been a key enabling technology for consumer electronics over the past decade and are also a vital component for the further development and adoption of Electric Vehicles (EVs).

However, raw material cleanliness of precursor powders is key to battery performance and reliability. The presence of impurities and contaminants in the material used in the production of Li-ion batteries can significantly undermine battery performance, or, in a worst-case scenario, have catastrophic impacts by causing major failure (fires/explosions), compromising thus battery safety and reliability. As such, monitoring of the quality and cleanliness of materials throughout the production process is essential if contaminants are to be found and their sources controlled.

Energizing Research in Battery Performance with Advanced Atomic Force Microscopy (AFM)

Dr. Nate Kirchhofer, Oxford Instruments Asylum Research

June 10: 6-7pm BST | 7-8pm CEST | 1-2pm US EDT

Beginning with a brief introduction to the basics of batteries and their engineering goals, examples will then be presented on how an Atomic Force Microscope (AFM) can be used for advanced operando and in-situ measurements that aid in battery optimization. Details will be presented on how to implement the environmental and electrochemical control that are critical for conducting operando battery research, while real examples will be presented that show how the AFM already contributes to improving different battery components such as the anode, cathode, separator, solid electrolyte interphase (SEI), electrolyte, and more. In this talk, expect to walk away with: (1) Practical considerations for achieving in-situ and operando imaging on electroactive materials, (2) how the state-of-the-art Asylum AFMs enable advanced electrochemical measurements on battery materials without sacrificing imaging resolution, (3) benefits of blueDrive photothermal excitation for electrochemical AFM, and (4) recent case studies of in-situ and operando measurements on the cathode, anode, separator, and more. Learn more at http://afm.oxinst.com/battery