Meet Oxford Instruments at PIC Summit Europe 2026

Oxford Instruments Plasma Technology is proud to partner with PIC Summit Europe 2026, Europe's leading event for the integrated photonics industry. As photonic integrated circuits (PICs) move from research into high-volume manufacturing, the focus is shifting to industrialisation, yield improvement, advanced packaging, testing, and scalable production.

Our advanced plasma etch and deposition technologies help enable the next generation of photonic devices for optical communications, AI infrastructure, sensing, quantum technologies, LiDAR, and datacentres. 

Enabling Scalable Photonics Manufacturing

Oxford Instruments supports the fabrication of photonic devices with solutions including:

• ICP Etch for precise waveguide and photonic structure fabrication with excellent profile control and low optical loss.
• Atomic Layer Deposition (ALD) for high-quality conformal films, passivation layers, and advanced dielectric coatings.
• Atomic Layer Etching (ALE) for atomic-scale process control and ultra-low-damage pattern transfer for next-generation photonic and quantum devices
  

From Innovation to Deployment

PIC Summit Europe 2026 brings together the entire photonics ecosystem to address the challenges of scaling PIC production and accelerating commercial adoption. Oxford Instruments is committed to helping customers bridge the gap between innovation and manufacturing with process solutions designed for both R&D and production environments

Join us at PIC Summit Europe 2026 to discuss how our plasma processing solutions can support your photonics roadmap, from device development to volume manufacturing.

For further information about the event, visit the PIC Summit Europe 2026 webpage.