The 7th International Conference on Emerging Electronics (ICEE 2025) will take place from December 13 to 16, 2025, in Bengaluru, India, highlighting advanced discussions and partnerships in semiconductor technologies.
India is a rising player in the global semiconductor industry, with the region’s chip market projected to surpass $55 billion in size by 2026.
Shape your future of electronics in India and advance your semiconductor fabrication and characterisation processes with Oxford Instruments’ full spectrum of solutions. Achieve precise and consistent etch, deposition and growth of micro- & nano-structures and films, using atomic layer etch (ALE), atomic layer deposition (ALD), ICP (etch & dep), PECVD and Plasma Polish Dry Etch for SiC processing with our plasma technology solutions. Measure crystal homogeneity, material stress and strain in 3D with Raman imaging microscopy; characterise defects, roughness, elasticity and electronic properties using Atomic Force Microscopy (AFM); evaluate structure and elemental composition with the electron microscopy techniques: EDS, EBSD, and the revolutionary BEX (Backscattered Electron and X-Ray).
For further information, visit the ICEE India 2025 webpage.
Meet the Oxford Instruments team at our booth and discuss your current work and process challenges. Schedule a dedicated meeting with us today!
We are delighted to announce that our expert, Dr Vijay Ramya Kolli, will be one of the speakers of the conference. Find out more details below.
Location
Bengaluru, India
Date
13-16 December 2025
Booth Number
TBC
Dr Vijay Ramya Kolli - Head of Strategic Production Markets in Oxford Instruments Plasma Technology
Title: Enabling High-Volume Semiconductor Manufacturing: Plasma Processing for Power and Datacom Applications
Date: TBC
As demand surges for more efficient power devices and high-bandwidth datacom components, manufacturers face increasing pressure to scale production without compromising performance or yield. This talk explores how advanced plasma processing techniques are enabling high-throughput, high-reliability semiconductor manufacturing. We’ll highlight solutions tailored for volume production environments, focusing on process scalability, uniformity, and device performance. Key challenges - including managing tight process windows, integrating new materials, and achieving consistent results across high wafer volumes - will be discussed, with insights into how plasma processes are being adapted to meet the practical needs of next-generation device fabrication at scale.
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