Meet Oxford Instruments at the event for semiconductor manufacturing in Tokyo, Japan

The Semicon Japan event is the premier exhibition for the semiconductor manufacturing supply chain for the latest developments, trends and innovations as the industry powers digital transformation. 

Advance your semiconductor fabrication and characterisation processes with Oxford Instruments’ full spectrum of solutions.

Achieve precise and consistent etch, deposition and growth of micro- & nano-structures and films, using atomic layer etch, atomic layer deposition, ICP (etch & dep), PECVD and Plasma Polish Dry Etch for SiC processing with our plasma technology solutions.

Measure crystal homogeneity, material stress and strain in 3D with Raman imaging microscopy; characterise defects, roughness, elasticity and electronic properties using Atomic Force Microscopy (AFM); evaluate structure and elemental composition with the electron microscopy techniques: EDS, EBSD, and the revolutionary BEX (Backscattered Electron and X-Ray). For further information, visit the Semicon Japan 2025 webpage.

Our team is looking forward to meeting you at the booth #E4536 (East Hall 5) and discussing your current work and process challenges! Schedule a dedicated meeting with us today!