SPIE Advanced Lithography

SPIE Advanced Lithography 2022

For over 40 years, SPIE Advanced Lithography has played a key role in bringing together the micro- and nanolithography community. Lithography continues to be challenged to extend into ever-shrinking generations, yet remain manufacturable and cost-effective.

Talks

Wednesday 26 February 2020

  • SESSION 5:  Low damage etching by Inductively Coupled Plasma (ICP) and Atomic Layer Etching (ALE) of III-V materials to enable next generation device performance. Author(s): ):  Mark Dineen, Matthew Loveday, Andy Goodyear, Mike Cooke, Andrew Newton, Stephanie Baclet, Tania Hemakumara Oxford Instruments Plasma Technology Ltd (UK).

  • SESSION 6: Atomic Layer Etching of III-V materials to enable next generation device performance (Invited Paper), Craig Ward, Oxford Instruments Plasma Technology Ltd ( USA).

We're looking forward to meeting you at the event and discussing your current work and workflows with you. If you would like to book a meeting with us at the conference, please complete the form below.

For further information: SPIE Advanced Lithography

Location

San Jose, California, USA

Booth Number: 3213

Date

23-27 February 2020

Business

Plasma Technology

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