CS International is one of the leading conferences dedicated to the compound semiconductor industry. The 13th edition of the event will be divided into five key themes focusing on: ultrafast communication, MicroLED, silicon power, VCSEL, and Ultra-wide Bandgap Devices.
Oxford Instruments Plasma Technology team is looking forward to welcoming you to Brussels, Belgium on the 18 - 19 April 2023 to discuss your current projects and workflows. If you would like to book a meeting with us during the event, please complete the form below.
During the CS International Conference, Amandev Singh, Product Manager at Oxford Instruments Plasma Technology, will be giving a talk on the 19th of April, Wednesday, at 2:05 pm (CET) during the "Taking the power from silicon" theme session:
Talk Title: Plasma-Polish Dry Etch: Smoothing solution to prepare Epi-Ready SiC for Power Applications
Silicon Carbide (4H-SiC) is an ideal wide bandgap semiconductor for high-voltage (>1.2kV) power applications, because of its unique material properties. However, with these unique properties come processing challenges, with development required to maintain high yield, and high substrate costs which contribute significantly to device costs. Oxford Instruments has developed and launched their Plasma Polish process, a contactless and scalable smoothing process on their existing PlasmaPro 100 etch platform, to prepare SiC wafers for epi, which addresses yield and cost challenges in SiC device production. During the talk, Amandev will share their progress on the productization of this contactless SiC smoothing process.
Visit the CS International Agenda
Location
Brussels, Belgium
Date
18 - 19 April 2023
Booth Number
Oxford Instruments booth
Business
Plasma Technology
Amandev Singh supports Oxford Instruments Plasma Technology as SiC Program Product Manager, to leverage their extensive expertise in Compound Semiconductors to bring valuable solutions to semiconductor fab operators.
Trained as a Physicist and Business Economist, he has over 10 years of experience in the semiconductor industry supporting fab operations in leading edge Silicon chip manufacturing. He is a well-rounded semiconductor professional with experience ranging from product development to commercialization as well as corporate strategy within the chip manufacturing ecosystem.
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