Sep
14

Dry Processing Workshop 2022

DRY PROCESSING WORKSHOP: DEPOSITION & ETCHING

14 - 15 September 2022 

Dry Processing Workshop is an interactive workshop designed for Oxford Instruments Plasma Technology equipment users, presented by Oxford Instruments and hosted at NaMLab.

This 2-day event will be held at the NaMLab facility in Dresden, Germany.

The cost for General Admission is 240 Euros, which includes entry to the event on both days and dinner on the first evening. We provide other ticket options for registrants who cannot attend both days of the workshop. 

Please register your interest in the event below*.

REGISTER YOUR INTEREST

Location

Dresden, Germany

Business

Plasma Technology


Hosted at NaMLab REGISTER YOUR INTEREST

Agenda

Wednesday 14th September 2022

  • Atomic Layer Deposition (ALD) of high-quality gate dielectrics to enable next generation GaN HEMTs
  • Nanoscale characterization of semiconductors with Atomic Force Microscopy
  • High Volume Manufacturing plasma processing for Compound Semiconductor based devices e.g. VCSELs, EEL and SiC PE
  • Latest advances in Atomic Layer Etching (ALE)
  • Materials and surface engineering for scalable low-loss superconducting Quantum computers
  • ALD of superconducting thin films for Quantum technology
  • Plasma etching and surface engineering for Diamond NV and other defect centres; applications and challenges
  • Wafer-scale growth of graphene and MoS2 and its encapsulation by ALD dielectrics
  • A precursor comparison for ALD based HfxZr1 − xO2thin films
  • Lab Tour / Poster Session
Download the Agenda

Thursday 15th September 2022

  • Plasma deposition: PECVD or ICP CVD which process to use and when
  • Lithium Niobate Etching for low optical loss photonic and quantum devices
  • SiC etching for via holes & feature for RF and power applications
  • Review of InP etch process including end point detection
  • A review of deep Si etch techniques and their application to device manufacturing – Cryo, Bosch, mixed gas; which one is best to use for which application
  • How to use End Point Detection techniques to monitor and control plasma processes
  • Process chamber management and achieving maximum system uptime using plasma cleaning
  • Reactive ion etching for AlScN based layers
  • Ion Beam Etch (IBE) for angled features – A unique capability

*Registration request is not confirmation of participation. Attendance is at the discretion of Oxford Instruments.

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