Workshop on dry processing for Nanoelectronics and Micromechanics deposition and etching

Sep

14

An interactive workshop designed for Oxford Instruments Plasma Technology equipment users, presented by Oxford Instruments, hosted at NaMLab.

This 2 day event will be held at the NaMLab facility in Dresden, Germany.

The cost to attend is 240 Euros, which will include entry to the event on both days, and dinner on the first evening.

Please register your interest in the event below*.

Location

Dresden, Germany

Business

Plasma Technology

Example Agenda**

Dry Etching for MEMS Applications - Deep Silicon Etch (DSiE) Techniques (Bosch, Cryogenic, mixed gas)
Tuning Materials Properties in Plasma ALD by Substrate Biasing
Latest advances in Atomic Layer Etching (ALE)
SiC Etching for Via Holes & Feature for RF & Power Applications
Review of InP Etch Process Including End Point Detection & Plasma Clean Processes
Plasma Deposition PECVD or ICP CVD - what process to use and when
Ion Beam Etch (IBE) for angled features – A unique capability
Ion Beam Deposition

Diamond Etching – Applications & Challenges
NbN ALD for Quantum Computing/Sensing
Plasma Technologies for Quantum Computing/Sensing
Atomfab: Atomic Layer Deposition (ALD) of high-quality gate dielectrics to enable next generation GaN HEMTs
How to use End Point Detection techniques to monitor and control plasma processes
Process chamber management and achieving maximum system uptime using plasma cleaning
Plasma solutions for high volume manufacturing focussing on AlGaAs/GaAs Processing for VCSEL Fabrication

*Registration request is not confirmation of participation. Attendance is at the discretion of Oxford Instruments.

**This agenda is for illustration purposes, the final agenda is to be confirmed.