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Plasmalab®µEtchEL entry-level dual-mode RIE/PE etch tool for failure analysis
The PlasmalabµEtchEL is a flexible and economic tool that offers a range of processes for failure analysis from isotropic passivation removal to anisotropic oxide removal, from small die or packaged devices through to 200 mm wafers.
Failure Analysis Process Applications
- Isotropic polyimide removal (RIE mode)
- Isotropic SiNx removal (PE mode)
- Anisotropic IMD/ILD etch (RIE mode), including low-k oxide
- Decoration/delineation (cross section to prepare for SEM)
Unique Process Performance Benefits
- Outstanding uniformity over 200 mm wafers
- Clean removal of polyimide, nitride and oxide
- Excellent run to run reproducibility
- High selectivity to underlayer material
Key System Features
- Dual-mode RIE/PE
- RF generator (300 W, 13.56 MHz)
- System pumped by RSV33/301BF Rootes rotary
- 4 gas lines (CF4, CHF3, O2, Ar)
- Automatic pressure control
- Capacitance manometer (1 Torr)
