Oxford Instruments specialises in the design, manufacture and support of innovative solutions, tools and systems for the emerging nanotechnology markets in areas such as XRF (X-ray Fluorescence) analysers , microanalysis systems, superconducting wires, NMR (nuclear magnetic resonance) magnets, cryogenic systems, plasma etch and deposition low temperature environments and coating thickness measurement.

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CMI165 Copper Thickness Measurement with Temperature Compensation for the PCB Industry

Copper Thickness Measurement with Temperature Compensation

CMI165

  • Measure hot or cold Cu on PCBs
  • Reduce waste by eliminating the need for coupons
  • Measure foil or laminated Cu thickness in µm, mils or oz
  • Sort Cu by weight at incoming inspection, before drilling, shearing or plating
  • Quantify Cu thickness after etching or planarizing
  • Verify Cu plating thickness on PCB surfaces

The CMI165 provides unique temperature compensated Copper thickness measurements in an ergonomic hand-held device.

Measurements on Copper are affected by the temperature of the sample.  The CMI165 accounts for temperature in the measurement of thickness ensuring accurate in-process inspection results regardless of Copper temperature.  This versatile, portable gauge equipped with protective case, has a rugged and durable design that allows it to be taken into the harshest environments. 


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