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Etching
Oxford Instruments offers a range of process solutions for etching of advanced materials for semiconductor, optoelectronic, photonics, MEMS and other nanotechnology applications.
Our range of solutions encompasses:
- Plasma etching
- Reactive ion etching (RIE)
- Inductively-coupled plasma (ICP) etch
- RIE/PE (plasma etch) dual mode tools for failure analysis dry etch de-processing
- Ion beam etch for a wide range of materials, many not etchable by plasma means
- Ion beam etching/milling (IBE/IBM)
- Reactive ion beam etching (RIBE)
- Chemically-assisted IBE (CAIBE)
Please select from the list of sub-applications within our "Product Finder" to help you locate the correct product, or choose from the list of "Related Products" in the section beneath it. Alternatively, please contact us to discuss your need, and our expert sales and applications staff will be pleased to help you select the right process and tools to meet your requirements.
Plasmalab®System133 300 mm and large batch plasma etch and deposition tool
Ionfab®300Plus ion beam etch and deposition tool
Product finder
Process News
Read about what's new in etching, deposition and growth More >>